OIF 3.2T Co-Packaged Module Standard

Key Specifications

• 3.2 Tb/s per module — first standardized CPO module
• 8x400Gb/s optical interfaces — FR4 and DR4 connectivity options
• 32 x CEI-112G-XSR host interface (or 32 x CEI-56G-XSR backwards compatible)
• Enables 51.2 Tb/s aggregate switch bandwidth when fully populated
• ~140G/mm bandwidth edge-density
• Module footprint: ~20x20 mm²

Power & Thermal

• 3.2T optical engine at 10pJ/bit = 32W per module
• Power density: 8W/cm² — higher than traditional optical industry norms
• Thermal management is a key design challenge for adoption

Market Projection

• CPO port deployments expected to exceed 10 million units by 2029
• Photonic IC + laser market: $2.4B (2023) → $5.9B (2029)

Significance

• Industry's first co-packaging standard — enables multi-vendor interoperability
• Backward compatibility with 50G lanes eases migration path
• Standardization is the critical enabler for volume production and cost reduction
• Sets the foundation for 6.4T and 12.8T future generations

Source: OIF 3.2T CPO Standard — OIF, 2023