Optical Computing

Download Report

Silicon photonics, co-packaged optics, photonic AI accelerators, optical neural networks

12Sources
3Concepts
2Entities
OverviewConceptsEntitiesSourcesPractice
TitleTypeAuthorDateKey Contribution
Integrated Platforms and Techniques for Photonic Neural NetworksPapernpj NanophotonicsMar 2025Comprehensive review of integrated photonic platforms for neural networks
Integrated Neuromorphic Photonic Computing for AI AccelerationPaperWang et al.Jun 2025Photonic tensor cores: 880 TOPS/mm2, 5.1 TOPS/W — 1-3 OOM over digital accelerators
Ultra-compact photonic AI chip operates at the speed of lightPaperJoel Sved et al.Mar 2026Inverse-designed nanophotonic neural network achieving 90-99% classification accuracy on 10K+ biomedical images at picosecond timescales
An integrated large-scale photonic accelerator with ultralow latencyPaperNatureJun 202516,000+ component photonic accelerator on single chip demonstrating ultralow latency and faster computing than commercial GPU
Lightmatter Passage L200: Record 1.6 Tbps Per FiberTech ReportLightmatterMar 2026Record 1.6 Tbps/fiber; L200 CPO enabling 200+ Tbps/package; 8x faster AI training
Ayar Labs UCIe Optical ChipletTech ReportAyar LabsJan 1970First UCIe optical chiplet. 16-wavelength SuperNova, 8 Tbps. TSMC COUPE partnership. $500M raise Mar 2026 (Nvidia-backed). Production samples 2026.
Ayar Labs raises $500M to mass-produce CPO chipletsTech ReportThe RegisterMar 2026$500M Series E for CPO mass production; TeraPHY delivers 200 Tbps/package — 5x Nvidia Rubin bandwidth
TSMC COUPE Platform for Silicon Photonics — Alchip + Ayar Labs DemoTech ReportTom's HardwareOct 2025First fully integrated COUPE-based optical I/O engine — 100 Tb/s per accelerator via UCIe interface
OIF 3.2T Co-Packaged Module Implementation AgreementTech ReportOptical Internetworking ForumApr 2023First industry co-packaging standard — 3.2Tb/s module with 8x400G optical interfaces enabling 51.2Tb/s switch bandwidth
Q.ANT NPU 2 Photonic Processor for AI and HPCTech ReportThe Quantum InsiderNov 2025Second-gen photonic processor claiming 30x lower energy and 50x higher performance for AI/HPC, shipping early 2026
The Shift to Photonics for Data Center Networks and AIAnalysisJan 1970Industry deployment timeline 2026-2028. Manufacturing, supply chain, integration realities.
Five Key Trends of Co-Packaged Optics (CPO) in 2026AnalysisSiemens EDAFeb 2026Industry analysis: CPO reduces link power 30W→9W, UCIe optical extends package boundaries, thermal management is critical blocker
Optical Computing | KB | MenFem