TSMC to Quadruple Advanced Packaging Capacity: Reaching 130,000 CoWoS Wafers Monthly by Late 2026
COMPILED NOTES
TSMC CoWoS ramp: ~35K wafers/mo (late 2024) → 75K (end 2025) → 130K target (end 2026); NVIDIA secures ~60% of capacity.
TSMC to Quadruple Advanced Packaging Capacity: 130,000 CoWoS Wafers Monthly by Late 2026
Key Numbers
| Period | CoWoS capacity (wafers/month) |
|---|---|
| Late 2024 | ~35,000 |
| End of 2025 | ~75,000 (nearly doubled) |
| End of 2026 (target) | 120,000–130,000 (quadrupled vs. 2024) |
Facilities
- AP6 (Zhunan) — existing Advanced Backend facility, refining manufacturing process.
- AP7 (Chiayi) — poised to become the world's largest advanced packaging hub.
- AP8 (Tainan) — newly acquired, expanding the AP footprint.
Customer concentration
- NVIDIA reportedly secures ~60% of TSMC CoWoS capacity through this expansion (referenced from Astute Group reporting).
Bottleneck implications
- CoWoS-L and CoWoS-S variants reportedly fully booked through 2026; OSAT partners (ASE with CoWoP) stepping in to absorb overflow.
- Advanced packaging is named "the critical missing link in AI hardware" — connecting HBM stacks to compute dies.
Source: TSMC to Quadruple Advanced Packaging Capacity — FinancialContent, Feb 5 2026. Cross-refs: Astute Group — NVIDIA 60% CoWoS share, TrendForce — CoWoS-L/S fully booked.
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