Rung 08 HardwareSwitch rung

Micron Technology

company

memoryhbmhbm4dramai-memory

Type: Company (DRAM, HBM and flash maker, Boise, Idaho)

Micron is the third of the three companies that make high-bandwidth memory, beside SK hynix and Samsung. It matters to this rung for one reason: the bandwidth a memory stack delivers sets how fast a GPU can produce tokens in the decode phase, and Micron is one of the three hands that set that number and its price.

Until 2026-09-24 the rung named Micron only in passing. Its first primary source here is its own press release of 16 March 2026, which says Micron's HBM4 36GB 12-high part is in high-volume production and has been shipping in volume since Q1 calendar 2026, designed for NVIDIA Vera Rubin, at over 11 Gb/s per pin and over 2.8 TB/s per stack — 2.3× the bandwidth of its own HBM3E with over 20% better power efficiency — and that it has shipped samples of a taller 48GB 16-high HBM4 part (Micron HBM4).

Confidence: low. One source, and it is the maker describing its own product with figures written as floors. The KB holds nothing from Micron on capacity, share, price, margin or whether its 2026 HBM output is committed — so nothing here can move a supply estimate. The next source to add is a Micron quarterly results release.

Key Contributions

HBM4 36GB 12-high in high-volume production, volume shipments from Q1 CY2026; >11 Gb/s per pin, >2.8 TB/s per stack; 2.3× bandwidth and >20% power efficiency vs Micron HBM3E. Evidence: moderate — primary issuer press release, unbenchmarked (Micron HBM4)
HBM4 48GB 16-high at customer samples by March 2026 — 33% more capacity per placement. Samples, not volume. Evidence: moderate (Micron HBM4)

What This KB Does NOT Know

HBM capacity, wafer allocation and capex
HBM share against SK hynix and Samsung
HBM average selling price and margin
Whether 2026 HBM output is contracted, and to whom beyond the Vera Rubin design target